Semicon Raw Materials
Epoxy Molding Compound
Green and Non Green Molding Compound
MUF (Mold Under Fill)
Standard Pellets (35mm to 58mm Diameter/30g to 174g)
Mini Pellets (9.8mm to 18mm Diameter/2.0g to 13.5g)
Granulated Molding Compound (Compression molding)
Filler sieve sizes 20um, 25um, 32um, 45um, 55um, 75um and 125um.
Epoxy Die Attach Paste
Dispensing, B-Stage, Screen Printable, Die Attach Film
Conductive and Non Conductive type
Silver filled and Non Silver filled
Oven Cure, Snap Cure and Pot cure type of curing
EFD/ Musashi syringe (5cc /10cc), Bottle (30g, 50g, 100g)
UV Dicing Tape & Cover Tape
UV Dicing Tape for Wafer and Package
Dicing Film
Cover Tape for Carrier Tape Materials
